The grinding process has been evolving, in recent years, from a mere surface finishing operation to a high stock removal process. The current research work is focused on the development of new-generation single-layer diamond wheels that can accomplish the demanding high material removal rate (MRR) requirements with longer tool life without any wheel dressing. With the use of a novel coordinate-controlled grit patterning technique, single-layer brazed diamond wheels were fabricated with uniform and precise distribution of the abrasive particles, which enables the wheels to accommodate higher chip load without loading and to simultaneously possess stronger joint strength. The indigenously developed grinding wheel was tested under aggressive grinding conditions to machine Al-SiCP composite blocks up to a depth of 2.5 mm under a flood cooling environment. Grinding forces, real-time spindle power consumption, chip morphology, and post-grinding wheel morphology were investigated during the deep grinding experiments to evaluate the suitability of such wheels in stringent grinding conditions. Experiments were conducted up to a maximum uncut chip thickness of 5.4 μm and maximum specific MRR of 20.83 mm2/s. Specific grinding energy, as low as 10.8 J/mm3, was obtained at the grinding condition with an aggressiveness number of 19.04. The in-house developed patterned diamond grinding wheel could successfully grind the soft, sticky, and abrasive Al-SiCP composites without any trace of wheel loading or significant grit failures. In the end, the indigenously developed patterned grinding wheel was compared against a commercially procured competent single-layer grinding wheel while grinding the same Al-SiCP composite in high-pressure cooling conditions.