The talk will cover several key areas related to the thermal management of advanced electronics systems. Topics include the challenges and opportunities presented by the increasing power densities and thermal issues in next-generation electronic devices ranging from Portable electronics to Data centers, the latest research and innovations in thermal management techniques and materials, utilizing machine learning for optimizing the design and the potential impact of these advancements on the design and performance of future electronic systems. The talk will also likely delve into specific research projects namely air cooling, single and two phase liquid cooling, phase change materials and several academia Industry collaborations at Binghamton University that are contributing to the advancement of thermal management in electronics. Overall, the talk aims to provide a comprehensive overview of the current state and future direction of thermal management for next-generation electronics systems, with a focus on the research efforts at Binghamton University.