This work presents the development of a flat heat pipe, exploring the novel use of copper foam and copper microtubes as wick materials. The design methodology focuses on balancing capillary pressure against viscous losses within both the porous medium and the vapor region, aiming to determine the dry-out length for specific configurations. The study successfully determined a dry-out length of 3 cm for effectively dissipating 20 W of heat from a 5x5 mm² chip area using 95% porosity Cu foam. A flat heat pipe was then fabricated with dimensions 3 cm x 2 cm x 3.5 mm, incorporating Cu foam as the wick material. The fabrication process involved creating a cavity in a Cu plate, positioning the Cu foam wick at the bottom with micro-pillars, and hermetically sealing the assembly through laser welding. An experimental setup for filling the working fluid, involving a syringe, pressure transducer, and vacuum pump for cavity evacuation, was established. The design and fabrication process also included an arrangement for sealing the filling ports with solder iron heating. Moreover, a lumped parameter design analysis was developed for a flat heat pipe utilizing an array of copper micro capillary tubes as the porous medium, advancing the design and efficiency of flat heat pipes in thermal management applications.